Electronic PCBA SMD DIP Assembly

1LayersSingle Sided,2 to 18 Layer 2Board material typeFR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more 3Compound material lamination4 to 6 layers 4Maximum dimens

1LayersSingle Sided,2 to 18 Layer
 2Board material typeFR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more
 3Compound material lamination4 to 6 layers
 4Maximum dimension610 x 1,100mm
 5Dimension tolerance±0.13mm
 6Board thickness coverage0.2 to 6.00mm
 7Board thickness tolerance±10%
 8DK thickness0.076 to 6.00mm
 9Minimum line width0.10mm
10Minimum line space0.10mm
11Outer layer copper thickness8.75 to 175µm
12Inner layer copper thickness17.5 to 175µm
13Drilling hole diameter (mechanical drill)0.25 to 6.00mm
14Finished hole diameter (mechanical drill)0.20 to 6.00mm
15Hole diameter tolerance (mechanical drill)0.05mm
16Hole position tolerance (mechanical drill)0.075mm
17Laser drill hole size0.10mm
18Board thickness and hole diameter ratio10:1
19Solder mask typeGreen, Yellow, Black, Purple, Blue, White and Red
20Minimum solder maskØ0.10mm
21Minimum size of solder mask separation ring0.05mm
22Solder mask oil plug hole diameter0.25 to 0.60mm
23Impedance control tolerance±10%
24Surface finishHot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger

 

 

♦ All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.

 

 

2.Lead time

 

Samples:4 to 5 days Mass produce:7 to 15 days depend on your PCB orders

 

3.Payment Terms  

 

T/T, WEST UNION, Paypal ECT Accepted

 

4.produce capacity

 

250000 Squre meter per year