Specializing in the develop and manufacturing of electronic products PCB design, layout, fabrication, assembly and function test.

Detailed Specification of PCB Manufacturing:

Material: FR4, High TG FR4, Halogen Free material, CEM-3, Rogers HF material, etc.

Layer counts: 2-28 layers

Finished Copper Thickness: 0.5-5 OZ

Finished Board Thickness: 0.2-6.0mm

Min. Line/Track Width: 4mil

Min. Line/Track Space: 4mil

Min. Contour Tolerance: +/-0.1mm

Min. Finished Diameter of PTH Hole: 0.2mm

Max. Board Thickness/Hole Ratio: 12:1

Min. Solder Mask Bridge: 4mil (Min. SMT Pad Space 8mil)

Min. Legend (Silk screen) Track Width: 5mil

Min. Legend (Silk screen) Height: 30mil

Min. drilling slot size: 0.6mm

Solder mask color: green, black, blue, white, yellow, purple, and matt, etc.

Solder mask hardness: 6H

Legend/Silk screen Color: white, yellow, black, etc.

Surface Treatment: HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc.

Other Technology: Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board etc.

Reliability Test: flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micro metallographic section analysis, etc.

Wrap and twist: ≤0

Flammability: 94V-0