Specializing in the develop and manufacturing of electronic products PCB design, layout, fabrication, assembly and function test.
Detailed Specification of PCB Manufacturing:
Material: FR4, High TG FR4, Halogen Free material, CEM-3, Rogers HF material, etc.
Layer counts: 2-28 layers
Finished Copper Thickness: 0.5-5 OZ
Finished Board Thickness: 0.2-6.0mm
Min. Line/Track Width: 4mil
Min. Line/Track Space: 4mil
Min. Contour Tolerance: +/-0.1mm
Min. Finished Diameter of PTH Hole: 0.2mm
Max. Board Thickness/Hole Ratio: 12:1
Min. Solder Mask Bridge: 4mil (Min. SMT Pad Space 8mil)
Min. Legend (Silk screen) Track Width: 5mil
Min. Legend (Silk screen) Height: 30mil
Min. drilling slot size: 0.6mm
Solder mask color: green, black, blue, white, yellow, purple, and matt, etc.
Solder mask hardness: 6H
Legend/Silk screen Color: white, yellow, black, etc.
Surface Treatment: HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc.
Other Technology: Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board etc.
Reliability Test: flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micro metallographic section analysis, etc.
Wrap and twist: ≤0