Ceramic substrate PCB circuit board processing
High thermal conductivity, non-toxic, can replace BeO ceramic substrates, customized products, smt patch processing, assembly testing one-stop service
1. Higher thermal conductivity and better thermal expansion coefficient;
2. Stronger and lower resistance conductive metal film;
3. The solderability and solder resistance of the substrate are good, and the temperature range is wide;
4. Good insulation;
5. The thickness of the conductive layer is adjustable within 1μm～1mm;
6. The high frequency loss is small, and the high frequency circuit design and assembly can be carried out;
7. High-density assembly is possible, and the line/spacing (L/S) resolution can reach up to 20μm, so as to realize the short, small, light and thin equipment;
8. It does not contain organic ingredients, is resistant to cosmic rays, has high reliability in aerospace and has a long service life;
9. The copper layer does not contain an oxide layer and can be used for a long time in a reducing atmosphere.
10. Three-dimensional substrate and three-dimensional wiring.